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KMID : 0988420020140030243
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Journal of Dental Science (C.N.U.)
2002 Volume.14 No. 3 p.243 ~ p.251
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A Comparative Study of Electroplating and Electroless Plating for Diameter increase of Orthodontic Wire
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Abstract
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The purpose of this study was to evaluate electroless plating as a method to increase diameter of an orthodontic wire through comparison with eletroplating.
After pretreatment for plating to the stainless steel orthodontic wire of 0.016 inch. the electoless plating was done under the condition of 90´c until the diameter of the wire was increased to 0.018 inch using Hessonic-Gr^® which was sold by Shin-Pung metal. On the process of electroless plating the diameter of wire was measured every 5 minute to examine the increasing ratio of the wire´s diameter per time unit. And to examine the uniformity, the diameter of each 3 points of the electroless-plated orthodontic wire was measured. An X-ray diffraction test was performed to analyze the nature of the plated metal and physical property test was made. Through the comparison with electroplating, following results were obtained.
1. In stiffness. yield strength, and ultimate strength of electroless plating wire group showed higher tendency than those of electroplated wire group, and in stiffness and ultimate strength there was statistically significant difference between two groups.
2. In the electroless plating wire group. the increasing ratio of the diameter was 0.O0461±0.00003 mm/5min (0.O0092 mm/min). In the electroplated wire group, that was 0.O0821±0.O0015 mm/min.
3. The results of uniformity test to measure the diameter of each 3 points showed a tendency of uniformity in all the two plating method.
The results of this study suggest that the electroless plating wire is more close to the ready-made wire than electroplating wire in terams of the physical property. On the other hand. the length of plating time should be solved for the clinical application of electroless plating.
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